For hard-to-clean solder paste or SMD adhesives in the under stencil cleaning process. This solvent-based, pH-neutral cleaner blend efficiently removes residues of leaded, lead-free, no-clean solder pastes and SMT-adhesives during the underside wiping process in automatic stencil printers.
Hyperclean USC20 shows excellent wetting properties to cleaning rolls and papers as well as stencil materials which grant stable and high-quality cleaning results. USC20 has a well-balanced evaporation rate.
| Appearance/Consistency: | Colourless to slightly yellow, clear |
| Application: | Ready-to-use |
| pH-value: | Neutral |
| Density at 20 °C: | 0,821 +/- 0,005 g/cm³ |
| Boiling point/boiling range: | 170°C-210°C |
| System: | Waterbased |
| Flashpoint: | 63°C |
| Operations temperature: | Room temperature |
| Reliable cleaning results with: | Leaded, lead-free, no-clean solder pastes SMT-adhesives |
| Shelf life: | 36 month |
| Storage conditions: | Ideal in original packaging at 10°C-25°C |
| Transportation: | Non-DG |
USC10 can be used for all standard under stencil cleaning purposes in SMT printers. This water-based, pH-neutral cleaning media efficiently removes residues of leaded, lead-free, no-clean solder pastes and SMT-adhesives during the underside wiping process in automatic stencil printers.
USC10 has well-balanced evaporation properties and due to the homogeneous formulation, smudges and cleaning media droplets are minimized.
| Appearance/Consistency: | Colourless to slightly yellow, clear |
| Application: | Ready-to-use |
| pH-value: | Neutral |
| Density at 20 °C: | 0,965 +/- 0,005 g/cm³ |
| Boiling point/boiling range: | >100°C |
| System: | Waterbased |
| Flash point: | 61°C |
| Operations temperature: | Room temperature |
| Reliable cleaning results with: | Leaded, lead-free, no-clean solder pastes SMT-adhesives |
| Shelf life: | 36 month |
| Storage conditions: | Ideal in original packaging at 10°C-25°C |
| Transportation: | Non-DG |